BMH20C, BMH20E,BMH20M nRF54H20 Bluetooth 6.0 Thread, Zigbee Modules

No External Component Required, Minimum Host PCB Area

BMH20C is a Nordic nRF54H20 BLE 6.0 module with a dualcore Cortex M33 MCUs at up to 320MHz and a dualcore RISC-V at up to 320 MHz. Both 32 MHz and 32.768 KHz, -40C to +105C, 20PPM crystals are integrated. Host PCB area is minimized without needing an external component.

BMH20C is footprint-upgradeable from BM15C, an nRF54L15 module. It is also footprint upgradeable to WM02CH20C, an nRF54H20 and nRF7002 WiFi 6 combo module.

Module Summaries

BMH20C

• Size 10x15.8x2mm

• High performance chip antenna.

• Availability: Preorder up to 5 BMH20C modules and 1 EV-BMH20C for quick delivery. Module sample quantity is limited. Shipment of a larger order will be held till better availability of nRF54H20 samples. You must be on the Nordic Limited Sampling Program before sample shipment. Please contact Fanstel for detail.

BMH20M

• Size 10x14x2mm

• PCB antenna.

BMH20E

• Size 10x14x2mm

• an u.FL connector for external antenna.

BMH20C Specifications:  

BLE 6.0, IEEE 802.15.4-2006 Transceiver

• Complete RF solution with integrated antenna

• BLE: 2Mbps, 1Mbps, 500kbps, 125kbps.

• IEEE 802.15.4-2006: 250 kbps.

• Proprietary: 4Mbps, 2Mbps, 1Mbps.

• Programmable TX power, +10 dBm.

• AoA and AoD direction finding using BLE.

Platform Security

• PSA Level 3.

• Secure Boot, Secure firmware Update, and Secure Storage.

• Root of Trust and Physically Uncloneable Function (PUF).

• Cryptographic accelerators hardened against side-channel attacks.

• Tamper detection.

Application processor

• ARM Cortex M33, 320MHz.

• 32 KB tightly coupled RAM.

• Dynamic Voltage-Frequency Scaling (DVFS)

• TrustZoneR FPU, DSP.

Radio processor

• ARM Cortex M33, 256MHz.

• 192 KB tightly coupled RAM.

• TrustZoneR FPU, DSP.

Co-processor

• 320MHz, RiSC-V with 64 KB of tightly coupled RAM.

• 16 MHz RISC-V with 64 KB of tightly coupled RAM.

Memory

• 2MB non-volatile M-RAM, 2 independent banks.

• 768 KB RAM.

• External memory interface, XiP-capable, supporting QSPI, xSPI, HyperBus, up to 400 MB/s.

Peripherals

• High-speed USB (480 Mbps).

• CAN FD controller

• 2 x I3C

• Audio PLL, 2 x TDM, PDM.

• 8 x SPI/TWI/UART.

• 14-bit ADC, COMP and LPCOMP.

• NFC.

• 2 x High speed timer and 8 x timer, Global RTC.

• SIMIF (ISO 7816-compatible interface to smart cards).

• 2 x QDEC.

• 64 GPIOs.

• 90 LGA pins.   

• 1.8V and 3.3V supply voltage.

• Operation temperature: -40°C to +105°C

Applications

• Advanced wearables

• Smart home and Matter

• Medical and healthcare

• LE Audio

• Industrial

• Gaming

• Virtual reality and augmented reality

• E-mobility 

Certifications

• FCC ID:

• ISED ID:

• Europe:

• Australia and New Zealand:

• Japan TELEC:

• QDID:

• Availability:

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For volume discount and production lead time, please email Fanstel.